Title :
Tailoring of insulation and adhesives for superconducting magnets and devices
Author :
Tupper, M.L. ; Munshi, N.A.
Author_Institution :
Composite Technol. Dev. Inc., Lafayette, CO, USA
fDate :
6/1/1999 12:00:00 AM
Abstract :
Polymer-based insulation and adhesives are integral components of superconducting devices. These materials primarily provide mechanical strength and electrical insulation. Specialized formulations and evaluation techniques have been employed to make these materials suitable for the harsh cryogenic environment. Many devices require specialized or unique properties or processing. Composite Technology Development, Inc, (CTD) has developed substantial capability to tailor these products for use at cryogenic temperatures. Tailoring can provide enhanced mechanical and electrical properties. In addition, products can be tailored to provide more cost effective processing. Furthermore, thermal expansion, thermal conductivity, adhesion, and several other properties can also be tailored. Product tailoring techniques, test methods, product performance characteristics and processing parameters are discussed in the context of several case studies.
Keywords :
adhesives; cryogenics; mechanical strength; organic insulating materials; polymers; superconducting devices; superconducting magnets; thermal conductivity; thermal expansion; Composite Technology Development; adhesives; cost effective processing; cryogenic environment; electrical insulation; enhanced electrical properties; enhanced mechanical properties; mechanical strength; polymer-based insulation; processing parameters; product performance characteristics; resin viscosity lowering; superconducting devices; superconducting magnets; test methods; thermal conductivity; thermal expansion; Cryogenics; Dielectrics and electrical insulation; Magnetic materials; Plastic insulation; Polymers; Superconducting devices; Superconducting magnets; Superconducting materials; Thermal conductivity; Thermal expansion;
Journal_Title :
Applied Superconductivity, IEEE Transactions on