DocumentCode
1539743
Title
Tailoring of insulation and adhesives for superconducting magnets and devices
Author
Tupper, M.L. ; Munshi, N.A.
Author_Institution
Composite Technol. Dev. Inc., Lafayette, CO, USA
Volume
9
Issue
2
fYear
1999
fDate
6/1/1999 12:00:00 AM
Firstpage
216
Lastpage
219
Abstract
Polymer-based insulation and adhesives are integral components of superconducting devices. These materials primarily provide mechanical strength and electrical insulation. Specialized formulations and evaluation techniques have been employed to make these materials suitable for the harsh cryogenic environment. Many devices require specialized or unique properties or processing. Composite Technology Development, Inc, (CTD) has developed substantial capability to tailor these products for use at cryogenic temperatures. Tailoring can provide enhanced mechanical and electrical properties. In addition, products can be tailored to provide more cost effective processing. Furthermore, thermal expansion, thermal conductivity, adhesion, and several other properties can also be tailored. Product tailoring techniques, test methods, product performance characteristics and processing parameters are discussed in the context of several case studies.
Keywords
adhesives; cryogenics; mechanical strength; organic insulating materials; polymers; superconducting devices; superconducting magnets; thermal conductivity; thermal expansion; Composite Technology Development; adhesives; cost effective processing; cryogenic environment; electrical insulation; enhanced electrical properties; enhanced mechanical properties; mechanical strength; polymer-based insulation; processing parameters; product performance characteristics; resin viscosity lowering; superconducting devices; superconducting magnets; test methods; thermal conductivity; thermal expansion; Cryogenics; Dielectrics and electrical insulation; Magnetic materials; Plastic insulation; Polymers; Superconducting devices; Superconducting magnets; Superconducting materials; Thermal conductivity; Thermal expansion;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/77.783275
Filename
783275
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