• DocumentCode
    1539785
  • Title

    Three dimensional stability analysis of high-temperature superconductors using the finite element method

  • Author

    Burkhardt, E. ; Schwartz, J.

  • Volume
    9
  • Issue
    2
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    240
  • Lastpage
    243
  • Abstract
    As the properties of high-temperature superconducting tapes improve, practical design considerations require more detailed analysis to prevent quenching. An important issue for high-temperature superconductors is stability; i.e. the ability to maintain or recover superconductivity in the event of a thermal disturbance or flux jump. As a result of the broad range of temperature during a transition and the strong temperature dependence and anisotropy of the material properties, the finite element method (FEM) is used to solve the three-dimensional heat conduction equation. The minimum quench energy for several sources is determined. The different cases considered include: convective boundary condition, source in BSCCO or Ag, increased anisotropy of thermal conductivity of BSCCO, increased critical current density and a constant source in Ag Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag.
  • Keywords
    bismuth compounds; calcium compounds; copper compounds; critical current density (superconductivity); finite element analysis; heat conduction; high-temperature superconductors; silver; strontium compounds; superconducting tapes; thermal analysis; thermal conductivity; 3-D heat conduction equation; 3-D stability analysis; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag HTSC; convective boundary condition; design considerations; finite element method; high-temperature superconductors; minimum quench energy; thermal conductivity anisotropy; Anisotropic magnetoresistance; Bismuth compounds; High temperature superconductors; Stability analysis; Superconducting films; Superconducting transition temperature; Superconductivity; Temperature dependence; Thermal conductivity; Thermal stability;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.783281
  • Filename
    783281