• DocumentCode
    153994
  • Title

    Analysis and comparison of variations in double edge triggered flip-flops

  • Author

    Alioto, Massimo ; Consoli, Elio ; Palumbo, Gaetano

  • Author_Institution
    ECE - Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2014
  • fDate
    Sept. 29 2014-Oct. 1 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper, the impact of variations on the most representative double-edge triggered flip-flop (FF) topologies is comparatively evaluated in 65-nm CMOS. The analysis explicitly considers fundamental sources of variations such as process, voltage and temperature (PVT) variations. For each FF topology, the variations of the performance, the energy per cycle and the leakage power are statistically evaluated through Monte Carlo simulations. The analysis explicitly includes the important impact of layout parasitics in different respects. First, they are accounted for in the circuit optimization loop, rather than being considered an afterthought. In addition, interconnect variations are explicitly considered in the statistical characterization of the flip-flops. Results for the different FF topologies are compared to identify the potential advantages and drawbacks of each topology. To gain an insight into the impact of transistor sizing and load, each FF topology is analyzed under a wide range of design targets and loads. The conclusions of the analysis are a useful tool to assist the designer in the preliminary variation budgeting before detailed circuit design, as well as in selecting the most appropriate topology for a targeted application.
  • Keywords
    CMOS integrated circuits; Monte Carlo methods; circuit optimisation; flip-flops; statistical analysis; trigger circuits; variational techniques; CMOS; FF topology; Monte Carlo simulations; PVT variations; circuit design; circuit optimization loop; double edge triggered flip-flops; energy per cycle; interconnect variations; layout parasitic impact; leakage power; preliminary variation budgeting; process-voltage-temperature variations; size 65 nm; statistical characterization; transistor load; transistor sizing; variation source analysis; variation source comparison; Delays; Flip-flops; Sensitivity; Standards; Temperature sensors; Topology; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CMOS Variability (VARI), 2014 5th European Workshop on
  • Conference_Location
    Palma de Mallorca
  • Type

    conf

  • DOI
    10.1109/VARI.2014.6957076
  • Filename
    6957076