DocumentCode :
1540649
Title :
Stress-induced leakage current (SILC) and oxide breakdown: are they from the same oxide traps?
Author :
Pantisano, Luigi ; Cheung, Kin P.
Author_Institution :
IMEC, Leuven, Belgium
Volume :
1
Issue :
2
fYear :
2001
fDate :
6/1/2001 12:00:00 AM
Firstpage :
109
Lastpage :
112
Abstract :
Many research groups have used stress-induced leakage current SILC as a mean to measure the oxide traps (defects) buildup in the oxide film during electrical stress. It is commonly believed that these very same traps will lead to oxide breakdown when their density reaches a critical value. We studied the annealing kinetic of SILC as well as, the oxide breakdown distribution and found that they are quite different. Our result casts serious doubt on the validity of the popular assumption
Keywords :
MOSFET; interface states; leakage currents; semiconductor device breakdown; semiconductor device reliability; semiconductor-insulator boundaries; MOSFETs; SILC; Si-SiO2; annealing kinetic; electrical stress; heat treatment; oxide breakdown distribution; oxide traps buildup; stress-induced leakage current; Current measurement; Density measurement; Electric breakdown; Electron traps; Kinetic theory; Lead compounds; Leakage current; MOSFETs; Silicon; Stress measurement;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/7298.956704
Filename :
956704
Link To Document :
بازگشت