Title :
Stress-induced leakage current (SILC) and oxide breakdown: are they from the same oxide traps?
Author :
Pantisano, Luigi ; Cheung, Kin P.
Author_Institution :
IMEC, Leuven, Belgium
fDate :
6/1/2001 12:00:00 AM
Abstract :
Many research groups have used stress-induced leakage current SILC as a mean to measure the oxide traps (defects) buildup in the oxide film during electrical stress. It is commonly believed that these very same traps will lead to oxide breakdown when their density reaches a critical value. We studied the annealing kinetic of SILC as well as, the oxide breakdown distribution and found that they are quite different. Our result casts serious doubt on the validity of the popular assumption
Keywords :
MOSFET; interface states; leakage currents; semiconductor device breakdown; semiconductor device reliability; semiconductor-insulator boundaries; MOSFETs; SILC; Si-SiO2; annealing kinetic; electrical stress; heat treatment; oxide breakdown distribution; oxide traps buildup; stress-induced leakage current; Current measurement; Density measurement; Electric breakdown; Electron traps; Kinetic theory; Lead compounds; Leakage current; MOSFETs; Silicon; Stress measurement;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/7298.956704