DocumentCode :
1541085
Title :
Quench propagation properties in HTS pancake coil
Author :
Shimizu, S. ; Ishiyama, A. ; Kim, S.B.
Author_Institution :
Dept. of Electr., Electron. & Comput. Eng., Waseda Univ., Tokyo, Japan
Volume :
9
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
1077
Lastpage :
1080
Abstract :
In this paper, the authors present the results of experiments and computer simulations to make clear the quench propagation properties in Bi-2223/Ag superconducting multifilament tape. They developed a computer code based on the two dimensional finite element method (2-D FEM). Computed voltage and temperature traces during a quench agree well with the experimentally recorded voltage and temperature traces. Good agreement validates the computer code, making a useful tool in developing protection strategies for high-temperature superconducting (HTS) coils. Therefore, they simulate the quench process in a single pancake coil wound with Bi-2223/Ag superconducting multifilament tape with background magnetic field up to 10 T at 20 K using the developed computer code. The quench propagation properties and stability in HTS coils are discussed and compared with those in low-temperature superconducting (LTS) coils.
Keywords :
bismuth compounds; calcium compounds; copper compounds; finite element analysis; high-temperature superconductors; multifilamentary superconductors; silver; strontium compounds; superconducting coils; superconducting tapes; 10 T; 2-D FEM; 20 K; Bi-2223/Ag superconducting multifilament tape; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub x/-Ag HTSC pancake coil; background magnetic field; computer simulations; experiments; quench propagation properties; stability; Computational modeling; Computer simulation; Finite element methods; High temperature superconductors; Multifilamentary superconductors; Protection; Superconducting coils; Superconducting films; Two dimensional displays; Voltage;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.783484
Filename :
783484
Link To Document :
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