DocumentCode
1541292
Title
NVSim: A Circuit-Level Performance, Energy, and Area Model for Emerging Nonvolatile Memory
Author
Dong, Xiangyu ; Xu, Cong ; Xie, Yuan ; Jouppi, Norman P.
Author_Institution
Qualcomm, Inc., San Diego, CA, USA
Volume
31
Issue
7
fYear
2012
fDate
7/1/2012 12:00:00 AM
Firstpage
994
Lastpage
1007
Abstract
Various new nonvolatile memory (NVM) technologies have emerged recently. Among all the investigated new NVM candidate technologies, spin-torque-transfer memory (STT-RAM, or MRAM), phase-change random-access memory (PCRAM), and resistive random-access memory (ReRAM) are regarded as the most promising candidates. As the ultimate goal of this NVM research is to deploy them into multiple levels in the memory hierarchy, it is necessary to explore the wide NVM design space and find the proper implementation at different memory hierarchy levels from highly latency-optimized caches to highly density- optimized secondary storage. While abundant tools are available as SRAM/DRAM design assistants, similar tools for NVM designs are currently missing. Thus, in this paper, we develop NVSim, a circuit-level model for NVM performance, energy, and area estimation, which supports various NVM technologies, including STT-RAM, PCRAM, ReRAM, and legacy NAND Flash. NVSim is successfully validated against industrial NVM prototypes, and it is expected to help boost architecture-level NVM-related studies.
Keywords
integrated circuit modelling; random-access storage; NVSim; area model; circuit-level performance; energy model; memory hierarchy levels; nonvolatile memory; phase-change random-access memory; resistive random-access memory; spin-torque-transfer memory; Arrays; Distributed databases; Integrated circuit modeling; Nonvolatile memory; Phase change random access memory; Wires; Analytical circuit model; MRAM; NAND Flash; nonvolatile memory; phase-change random-access memory (PCRAM); resistive random-access memory (ReRAM); spin-torque-transfer memory (STT-RAM);
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2012.2185930
Filename
6218223
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