Title :
Alternative metals for advanced interconnects
Author :
Adelmann, C. ; Liang Gong Wen ; Peter, Antony Premkumar ; Yong Kong Siew ; Croes, Kristof ; Swerts, Johan ; Popovici, Mihaela ; Sankaran, K. ; Pourtois, G. ; Van Elshocht, S. ; Bommels, J. ; Tokei, Z.
Author_Institution :
Imec, Leuven, Belgium
Abstract :
We discuss the selection criteria for alternative metals in order to fulfill the requirements necessary for interconnects at half pitch values below 10 nm. The performance of scaled interconnects using transition metal germanides and CoAl alloys as metallization are studied and compared to conventional Cu and W interconnects.
Keywords :
aluminium alloys; cobalt alloys; copper; integrated circuit interconnections; integrated circuit metallisation; tungsten; CoAl; CoAl alloys; Cu; W; alternative metals; metallization; scaled interconnects; transition metal germanidesadvanced interconnects; Coal; Conductivity; Electromigration; Films; Metallization; Scattering;
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
DOI :
10.1109/IITC.2014.6831863
