• DocumentCode
    1542382
  • Title

    Economic Analysis of Testing Homogeneous Manycore Chips

  • Author

    Huang, Lin ; Xu, Qiang

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
  • Volume
    29
  • Issue
    8
  • fYear
    2010
  • Firstpage
    1257
  • Lastpage
    1270
  • Abstract
    The employment of a large number of structurally identical cores on a single silicon die is generally regarded as a promising solution for tera-scale computation, known as manycore chips. To ensure the product quality of such complex integrated circuits before shipping them to final users, extensive manufacturing tests are necessary and the associated test cost can account for a large share of the total production cost. By introducing spare cores on-chip, the burn-in test time can be shortened and the defect coverage requirements for core tests can be also relaxed, without sacrificing quality of the shipped products. If the above test cost reduction exceeds the manufacturing cost of the extra cores, the total production cost of manycore chips can be reduced. In this paper, we develop novel analytical models to study the above tradeoff and we verify the effectiveness of the proposed test economics model for hypothetical manycore chips with various configurations.
  • Keywords
    microprocessor chips; multiprocessing systems; homogeneous manycore chips; silicon die; tera-scale computation; test economics model; Automatic testing; Circuit faults; Circuit testing; Costs; Integrated circuit manufacture; Integrated circuit testing; Manufacturing processes; Power generation economics; Production; Silicon; Analytical model; manycore chip; product quality test economics;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2010.2049052
  • Filename
    5512694