DocumentCode
1542382
Title
Economic Analysis of Testing Homogeneous Manycore Chips
Author
Huang, Lin ; Xu, Qiang
Author_Institution
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
Volume
29
Issue
8
fYear
2010
Firstpage
1257
Lastpage
1270
Abstract
The employment of a large number of structurally identical cores on a single silicon die is generally regarded as a promising solution for tera-scale computation, known as manycore chips. To ensure the product quality of such complex integrated circuits before shipping them to final users, extensive manufacturing tests are necessary and the associated test cost can account for a large share of the total production cost. By introducing spare cores on-chip, the burn-in test time can be shortened and the defect coverage requirements for core tests can be also relaxed, without sacrificing quality of the shipped products. If the above test cost reduction exceeds the manufacturing cost of the extra cores, the total production cost of manycore chips can be reduced. In this paper, we develop novel analytical models to study the above tradeoff and we verify the effectiveness of the proposed test economics model for hypothetical manycore chips with various configurations.
Keywords
microprocessor chips; multiprocessing systems; homogeneous manycore chips; silicon die; tera-scale computation; test economics model; Automatic testing; Circuit faults; Circuit testing; Costs; Integrated circuit manufacture; Integrated circuit testing; Manufacturing processes; Power generation economics; Production; Silicon; Analytical model; manycore chip; product quality test economics;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2010.2049052
Filename
5512694
Link To Document