New fabrication process elements of phase-mode logic circuits

We present the phase-mode circuits based on new fabrication process elements for high-density circuit integration. Nb/AlN/sub x//Nb overdamped junctions without external resistive shunts are applied to the phase-mode circuits. The area of a bias feed resistor can be reduced by a replacement of the metallic resistor by the junction normal resistance. As a miniaturization method of an inductance, the effective inductance of a Josephson junction is used. The phase-mode circuits based on these new integration methods have been fabricated by Nb integration technology. Various aspects which are brought about by these fabrication technologies are discussed.