• DocumentCode
    1542700
  • Title

    The bulk high-Tc superconducting fluxgatemeter for nondestructive evaluation

  • Author

    Miyazaki, M. ; Nakane, H. ; Adachi, H.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Muroran Inst. of Technol., Hokkaido, Japan
  • Volume
    9
  • Issue
    2
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    3479
  • Lastpage
    3482
  • Abstract
    A high-T/sub c/ superconductive fluxgate magnetic sensor utilizing sintered YBa/sub 2/Cu/sub 3/O/sub 7-x/ core is constructed and applied to detect a flaw in an aluminum plate. The magnetic sensor successfully works in an unshielded environment. An electric current was supplied to an aluminum plate directly. A slit (0.2 mm width, 30 mm length), which is considered as a flaw, on an aluminum plate is successfully detected with this sensor, even though the slit is covered with another aluminum plate. The sensor can detect the flaw with its direction perpendicular to the electric current in the sample. It´s supposed that the sensor can determine the length of the flaw larger than the diameter of the detection coil. These results suggest that the sensor has a potential for nondestructive evaluation of non-magnetic metals such as aluminum alloys, and also for their multi-layered structures.
  • Keywords
    barium compounds; flaw detection; fluxgate magnetometers; high-temperature superconductors; superconducting devices; yttrium compounds; Al; YBa/sub 2/Cu/sub 3/O/sub 7-x/ sintered core; YBa/sub 2/Cu/sub 3/O/sub 7/; aluminum plate; bulk high-Tc superconductor; electric current; flaw detection; fluxgate magnetic sensor; multilayer structure; nondestructive evaluation; nonmagnetic metal; Aluminum; High temperature superconductors; Magnetic cores; Magnetic materials; Magnetic sensors; SQUIDs; Superconducting coils; Superconducting magnets; Superconducting materials; Superconductivity;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.783779
  • Filename
    783779