DocumentCode
154289
Title
Electromigration induced failure of solder bumps and the role of IMC
Author
Ceric, H. ; Selberherr, Siegfried
Author_Institution
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear
2014
fDate
20-23 May 2014
Firstpage
265
Lastpage
268
Abstract
Characteristic for solder bumps is that during technology processing and usage their material composition changes. We present a model for describing the growth of an intermetallic compound inside a solder bump under the influence of electromigration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.
Keywords
alloys; electromigration; integrated circuit interconnections; solders; IMC; electromigration induced failure; solder bumps; Chemicals; Integrated circuit interconnections; Nickel; Reliability; Resistance; Three-dimensional displays; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location
San Jose, CA
Print_ISBN
978-1-4799-5016-4
Type
conf
DOI
10.1109/IITC.2014.6831891
Filename
6831891
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