Title :
Atomic layer deposition of ultrathin and continuous metal films
Author_Institution :
Depts. of Chem. & Mech. Eng., Univ. of Colorado, Boulder, CO, USA
Abstract :
The atomic layer deposition (ALD) of ultrathin and continuous metal films is very challenging. This paper describes a general procedure that can yield an ultrathin and continuous metal ALD film using a W ALD adhesion layer.
Keywords :
adhesion; atomic layer deposition; metallic thin films; tungsten; ALD; W; adhesion layer; atomic layer deposition; continuous metal films; ultrathin metal films; Adhesives; Aluminum oxide; Atomic layer deposition; Films; Substrates; Surface treatment;
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
DOI :
10.1109/IITC.2014.6831898
