• DocumentCode
    154306
  • Title

    Photoemission study of the impact of carbon content on Mn silicate barrier formation on low-k dielectric materials

  • Author

    Bogan, J. ; McCoy, A.P. ; Casey, P. ; O´Connor, R. ; Byrne, Ceara ; Hughes, G.

  • Author_Institution
    Sch. of Phys. Sci., Dublin City Univ., Dublin, Ireland
  • fYear
    2014
  • fDate
    20-23 May 2014
  • Firstpage
    331
  • Lastpage
    334
  • Abstract
    In this x-ray photoelectron spectroscopy (XPS) study ultra-thin Si and MnO films were deposited on a range of low dielectric constant carbon doped oxides (CDO) with varying carbon content, in order to accurately determine the binding energy (BE) positions of the Si 2p and O 1s core level peaks as a function of carbon concentration. The results show a measurable correlation between carbon content and BE position of both the Si 2p and O 1s core level peaks. Furthermore, it has been shown that the full width at half maximum (FWHM) of the various CDO substrate peaks are significantly larger than for SiO2 making it difficult to unambiguously determine manganese silicate barrier layer formation on these substrates. In a separate set of experiments, the formation of a manganese silicate barrier layer on these CDO substrates following the deposition and high temperature annealing of thin MnO layers is inferred from analysis of the O1s and Mn2p core level spectra.
  • Keywords
    X-ray photoelectron spectra; annealing; binding energy; carbon; electron beam deposition; elemental semiconductors; low-k dielectric thin films; manganese compounds; permittivity; photoemission; silicon; silicon compounds; BE positions; C; CDO; FWHM; MnO; MnSiO3; Si; SiO2; X-ray photoelectron spectroscopy; binding energy; carbon concentration function; e-beam deposition; full width at half maximum; low dielectric constant carbon doped oxides; low-k dielectric materials; manganese silicate barrier layer formation; photoemission study; temperature annealing; Annealing; Carbon; Films; Manganese; Silicon; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-5016-4
  • Type

    conf

  • DOI
    10.1109/IITC.2014.6831900
  • Filename
    6831900