Title :
Full Wave Solution for Intel CPU With a Heat Sink for EMC Investigations
Author :
Lu, Junwei ; Zhu, Boyuan ; Thiel, David
Author_Institution :
Centre of Wireless Monitoring & Applic., Griffith Univ., Nathan, QLD, Australia
Abstract :
A CPU with a heat sink (e.g. Intel Pentium 4 and Intel Pentium dual core) is a challenging problem for EMC analysis. A Very Large Scale Integrated (VLSI) device was modelled using the Finite Element Method (FEM) frequency domain solver to obtain a 3D full wave solution. The electromagnetic (EM) radiation emitted from these high power microelectronic circuits connected to a heat sink was found to have resonant frequencies around 2.4 GHz and 5 GHz with reflection coefficients less than -19 dB and -8 dB respectively. These resonant frequencies are very close to the operating frequency of both IEEE and Bluetooth wireless communication systems. This paper proposes a new benchmark model based on a dual core CPU and dual-source model.
Keywords :
Bluetooth; VLSI; electromagnetic compatibility; electromagnetic waves; finite element analysis; heat sinks; microprocessor chips; 3D full wave solution; Bluetooth wireless communication system; EMC; IEEE; Intel CPU; Intel Pentium 4; Intel Pentium dual core; dual core CPU; dual-source model; electromagnetic radiation; finite element method frequency domain solver; heat sink; microelectronic circuits; very large scale integrated device; Central Processing Unit; Electromagnetic compatibility; Electromagnetic radiation; Finite element methods; Frequency domain analysis; Heat sinks; Microelectronics; RLC circuits; Resonant frequency; Very large scale integration; CPU; EMC; FEM; full wave solution;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2010.2044483
