Title :
High frequency circuit components on micromachined variable thickness substrates
Author :
Drayton, R.F. ; Henderson, R.M. ; Katehi, L.P.B.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
fDate :
2/13/1997 12:00:00 AM
Abstract :
The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented
Keywords :
MMIC; elemental semiconductors; etching; integrated circuit interconnections; integrated circuit technology; micromachining; microstrip circuits; silicon; substrates; HF circuit components; Si; Si micromachining techniques; anisotropic etching; high frequency planar circuit design; micromachined variable thickness substrates; selective locations; substrate thickness;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19970221
