DocumentCode
1543497
Title
High frequency circuit components on micromachined variable thickness substrates
Author
Drayton, R.F. ; Henderson, R.M. ; Katehi, L.P.B.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Volume
33
Issue
4
fYear
1997
fDate
2/13/1997 12:00:00 AM
Firstpage
303
Lastpage
304
Abstract
The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented
Keywords
MMIC; elemental semiconductors; etching; integrated circuit interconnections; integrated circuit technology; micromachining; microstrip circuits; silicon; substrates; HF circuit components; Si; Si micromachining techniques; anisotropic etching; high frequency planar circuit design; micromachined variable thickness substrates; selective locations; substrate thickness;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19970221
Filename
583489
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