DocumentCode
1543935
Title
Americans in Paris . . . [European Community]
Author
Stix, G.
Author_Institution
IEEE Spectrum, New York, NY
Volume
27
Issue
6
fYear
1990
fDate
6/1/1990 12:00:00 AM
Firstpage
55
Lastpage
56
Abstract
Steps being taken by US companies to prepare for the post-1992 European market are described. In some cases, US companies may be better organized than their European counterparts to deal with a unified market. However, US trade officials still fear possible trade barriers. In particular, Article 115 of the 1957 European Economic Treaty has been used to protect the domestic automobile industries. The single market that is supposed to emerge in 1992 will do away with Article 115, but some European Community (EC) members have simply proposed enacting similar trade rules on an EC-wide basis, rather than a national one. What has provoked the ire of some US high-technology companies is a 1989 change in EC rules of origin that allows a product to be classified as European. To get the made-in-Europe seal, semiconductor chips must be fabricated in EC territory, whereas previously they only had to be assembled into packages and tested in Europe. Some of the largest US electrotechnology companies-AT&T, DEC, and IBM-have joined the European Strategic Programme for Research and Development in Information Technologies (Esprit), and, in January, Philips Consumer Electronics Co., Thomson Consumer Electronics Inc., and NBC formed a high-definition television (HDTV) consortium
Keywords
economics; electronics industry; marketing; research initiatives; AT&T; DEC; EC; Esprit; Europe; European Community; European Economic Treaty; European Strategic Programme for Research and Development in Information Technologies; HDTV; IBM; NBC; Philips Consumer Electronics Co.; Thomson Consumer Electronics Inc.; USA; electrotechnology companies; high-definition television; semiconductor chips; trade barriers; Assembly; Automobiles; Consumer electronics; Electronics packaging; HDTV; Industrial economics; Protection; Seals; Semiconductor device packaging; Semiconductor device testing;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/6.58409
Filename
58409
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