Title :
On the De-Embedding Issue of Millimeter-Wave and Sub-Millimeter-Wave Measurement and Circuit Design
Author :
Zhang, Bo ; Xiong, Yong-Zhong ; Wang, Lei ; Hu, Sanming ; Li, Joshua Le-Wei
Author_Institution :
Xi´´an Univ. of Posts & Telecommun., Xi´´an, China
Abstract :
The purpose of this paper is to address the de-embedding issue of millimeter-wave (mmWave) and sub-mmWave measurements and circuit design by extensively comparing several commonly used methods and by proposing a new full-matrix calculation-based de-embedding methodology. The comparison aims to investigate the impacts of different de-embedding methods on mmWave and sub-mmWave circuit design. A new de-embedding method has been proposed to achieve more accurate results on mmWave and sub-mmWave range. In this method, all possible extrinsic elements are subtracted from the measured device under test data by matrix calculation to eliminate the error from equivalent circuit. The influence of parasitic elements on the fT and fMAX are investigated. The comparison of the different de-embedding methods for transistors are performed up to 170 GHz, the results showed that the proposed method has good accuracy even at very high-frequency and it is suitable for mmWave and sub-mmWave measurements and circuit design.
Keywords :
integrated circuit design; matrix algebra; millimetre wave integrated circuits; millimetre wave measurement; submillimetre wave integrated circuits; submillimetre wave measurement; circuit design; equivalent circuit; extrinsic elements; full-matrix calculation-based deembedding methodology; millimeter-wave measurement; sub-mmWave circuit design; submillimeter-wave measurement; test data; transistor deembedding methods; Circuit synthesis; Couplings; Integrated circuit interconnections; Matrix converters; Millimeter wave measurements; Scattering parameters; Semiconductor device measurement; $S$-parameters; de-embedding; millimeter-wave (mmWave) circuit design; on-wafer measurement;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2200482