DocumentCode :
1544316
Title :
Meetings
Volume :
11
Issue :
1
fYear :
1974
Firstpage :
8
Lastpage :
13
Abstract :
A three-day format of technical sessions will be just one of the innovations at this year´s IEEE International Convention and Exposition (IEEE INTERCON) in New York City on March 26–29. The exhibits will occupy two floors of the New York Coliseum and the technical program sessions will be held at the Statler Hilton Hotel.
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.1974.6501084
Filename :
6501084
Link To Document :
بازگشت