Title :
Slicing floorplans with boundary constraints
Author :
Young, F.Y. ; Wong, D.F. ; Yang, Hannah H.
Author_Institution :
Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
fDate :
9/1/1999 12:00:00 AM
Abstract :
In floorplanning of very large scale integration design, it is useful if users are allowed to specify some placement constraints in the packing. One particular kind of placement constraints is to pack some modules on one of the four sides: on the left, on the right, at the bottom, or at the top of the final floorplan. These are called boundary constraints. In this paper, we enhanced a well-known slicing floorplan algorithm to handle these boundary constraints. Our main contribution is a necessary and sufficient characterization of the Polish expression, a representation of the intermediate solutions in the simulated annealing process, so that we can check these constraints efficiently and can fix the expression in case the constraints are violated. We tested our algorithm on some benchmark data and the performance is good
Keywords :
VLSI; circuit layout CAD; integrated circuit layout; simulated annealing; Polish expression; VLSI; boundary constraints; floorplans; modules; packing; placement constraints; simulated annealing; slicing floorplan algorithm; very large scale integration design; Benchmark testing; Circuit simulation; Circuit testing; Costs; Design methodology; Integrated circuit interconnections; Runtime; Shape; Simulated annealing; Very large scale integration;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on