Title :
Part I: On the Behavior of STI-Type DeNMOS Device Under ESD Conditions
Author :
Shrivastava, Mayank ; Gossner, Harald ; Baghini, Maryam Shojaei ; Rao, V. Ramgopal
Author_Institution :
Infineon Technol., East Fishkill, NY, USA
Abstract :
We present experimental and simulation studies of shallow trench isolation (STI)-type drain-extended n-channel metal-oxide-semiconductor devices under human body model (HBM)-like electrostatic discharge (ESD) conditions. Physical insight toward pulse-to-pulse instability is given. Both the current (ITLP) and time evolution of various events such as junction breakdown, parasitic bipolar triggering, and the base push-out effect are discussed in detail. Differences between the 2-D and 3-D simulation (modeling) approaches are presented, and the importance of 3-D technology-computer-aided-design-based modeling is discussed. Furthermore, a deeper physical insight toward the base push-out is given, which shows significant power dissipation due of space charge build-up, which is found at the onset of self-heating in the 2-D plane.
Keywords :
CAD; MOS integrated circuits; electronic engineering computing; electrostatic discharge; 2D simulation approaches; 3D technology-computer-aided-design-based modeling; STI-type DeNMOS device; base push-out effect; electrostatic discharge conditions; extended n-channel metal-oxide-semiconductor devices; human body model; junction breakdown; parasitic bipolar triggering; pulse-to-pulse instability; shallow trench isolation; Biological system modeling; CMOS process; CMOS technology; Electrostatic discharge; Electrostatic interference; Humans; Protection; Semiconductor device modeling; Space charge; Space technology; Base push-out; Kirk effect; charge device model (CDM); charge modulation; current filamentation; drain-extended metal–oxide–semiconductor (DeMOS); electrostatic discharge (ESD); human body model (HBM); input–output (I/O); laterally diffused metal–oxide–semiconductor (LDMOS); space charge build-up; thermal runaway; transient interferometric mapping (TIM);
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2055276