DocumentCode :
1545330
Title :
Increasing process margin in SiGe heterojunction bipolar technology by adding carbon
Author :
Osten, H.J. ; Knoll, D. ; Heinemann, B. ; Schley, P.
Author_Institution :
Inst. for Semicond. Phys., Frankfurt, Germany
Volume :
46
Issue :
9
fYear :
1999
fDate :
9/1/1999 12:00:00 AM
Firstpage :
1910
Lastpage :
1912
Abstract :
The incorporation of low carbon concentration within the SiGe region of a heterojunction bipolar transistor (HBT) can significantly suppress boron outdiffusion caused by a variety of subsequent processing steps. Thus, it provides greater flexibility in process design and wider latitude in process margin. We demonstrate almost ideal base current characteristics and cutoff, maximum oscillation frequencies of more than 70 GHz, and delays per stage down to 15 ps for ring oscillators with integrated SiGe:C HBT´s
Keywords :
Ge-Si alloys; carbon; heterojunction bipolar transistors; semiconductor materials; 15 ps; 70 GHz; SiGe heterojunction bipolar transistor; SiGe:C; base current; carbon concentration; cutoff frequency; delay; high frequency device; integrated SiGe:C HBT; maximum oscillation frequency; outdiffusion; process margin; ring oscillator; Annealing; Boron; Carbon dioxide; Fabrication; Frequency; Germanium silicon alloys; Heterojunction bipolar transistors; Process design; Ring oscillators; Silicon germanium;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.784193
Filename :
784193
Link To Document :
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