• DocumentCode
    1546083
  • Title

    Optically interconnected electronic chips: a tutorial and review of the technology

  • Author

    Forbes, M. ; Gourlay, J. ; Desmulliez, M.

  • Author_Institution
    Analog-Mixed Signal Design Group, Tality Corp., Livingston, UK
  • Volume
    13
  • Issue
    5
  • fYear
    2001
  • fDate
    10/1/2001 12:00:00 AM
  • Firstpage
    221
  • Lastpage
    232
  • Abstract
    Optoelectronic interconnects between VLSI chips have been identified by the Semiconductor Industry Association (SIA) Roadmap as one of the few solutions to overcoming the communication bandwidth bottleneck between VLSI chips. Large-scale demonstrators based on optical interconnects, when fully operational, can exhibit today the same aggregate bandwidth as that foreseen by the Roadmap for the year 2007. Massive parallelism, low input/output driving energy over large distances, and synchronous processing of hundreds of optical information input channels mean that these prototypes can potentially provide on/off communication rates in the tera-pin-Hz region (i.e., a total capacity of one terabit/s). After discussing the limitations of electrical interconnects this paper reviews the means of integrating optoelectronic components with VLSI chips, suitable types of optoelectronic device and the three main approaches to constructing optical data links: fibre-ribbons, planar waveguides and free-space optics
  • Keywords
    VLSI; integrated optoelectronics; optical interconnections; optical links; parallel architectures; planar waveguides; Semiconductor Industry Association; VLSI chips; communication bandwidth bottleneck; electrical interconnects; fibre-ribbons; free-space optics; large-scale demonstrators; low input/output driving energy; massive parallelism; on/off communication rates; optical data links; optical information input channels; optical packaging; optically interconnected electronic chips; optoelectronic interconnects; planar waveguides; synchronous processing;
  • fLanguage
    English
  • Journal_Title
    Electronics & Communication Engineering Journal
  • Publisher
    iet
  • ISSN
    0954-0695
  • Type

    jour

  • DOI
    10.1049/ecej:20010506
  • Filename
    962669