• DocumentCode
    1546239
  • Title

    Design for semiconductor manufacturing. Bibliography

  • Author

    White, K. Preston, Jr. ; Trybula, Walter J. ; Athay, Robert N.

  • Author_Institution
    Dept. of Syst. Eng., Virginia Univ., Charlottesville, VA, USA
  • Volume
    20
  • Issue
    1
  • fYear
    1997
  • fDate
    1/1/1997 12:00:00 AM
  • Firstpage
    73
  • Lastpage
    86
  • Abstract
    Interest in integrating the design and manufacture of semiconductor devices has been growing over the past decade. Often referred to as design for manufacture (DFM), integrated product development seeks to conceive and refine design alternatives that make the best use of manufacturing capabilities, in terms of the various materials, processes, tools, equipment, and facilities available to realize the design. While there is a large and growing literature on DFM generally, comparatively little of the published work addresses design for semiconductor manufacturing (DFSM) specifically, or the unique technologies and special circumstances of the semiconductor industry. In this paper, we present the results of a DFSM literature and software survey undertaken during the period June 1995 through August 1996. We describe the methods and sources used in the survey and include the complete abstracts of 61 articles determined to be most significant for DFSM. Also included is listing and brief description of some related software packages, which are available commercially or by anonymous ftp from a number of World Wide Web sites
  • Keywords
    bibliographies; design for manufacture; digital simulation; integrated circuit manufacture; integrated circuit modelling; software packages; DFM; bibliography; design alternatives; design for manufacture; integrated product development; literature survey; manufacturing capabilities; semiconductor manufacturing; software packages; software survey; Abstracts; Bibliographies; Design for manufacture; Electronics industry; Manufacturing processes; Product development; Refining; Semiconductor device manufacture; Semiconductor devices; Semiconductor materials;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4400
  • Type

    jour

  • DOI
    10.1109/3476.585146
  • Filename
    585146