DocumentCode
1546239
Title
Design for semiconductor manufacturing. Bibliography
Author
White, K. Preston, Jr. ; Trybula, Walter J. ; Athay, Robert N.
Author_Institution
Dept. of Syst. Eng., Virginia Univ., Charlottesville, VA, USA
Volume
20
Issue
1
fYear
1997
fDate
1/1/1997 12:00:00 AM
Firstpage
73
Lastpage
86
Abstract
Interest in integrating the design and manufacture of semiconductor devices has been growing over the past decade. Often referred to as design for manufacture (DFM), integrated product development seeks to conceive and refine design alternatives that make the best use of manufacturing capabilities, in terms of the various materials, processes, tools, equipment, and facilities available to realize the design. While there is a large and growing literature on DFM generally, comparatively little of the published work addresses design for semiconductor manufacturing (DFSM) specifically, or the unique technologies and special circumstances of the semiconductor industry. In this paper, we present the results of a DFSM literature and software survey undertaken during the period June 1995 through August 1996. We describe the methods and sources used in the survey and include the complete abstracts of 61 articles determined to be most significant for DFSM. Also included is listing and brief description of some related software packages, which are available commercially or by anonymous ftp from a number of World Wide Web sites
Keywords
bibliographies; design for manufacture; digital simulation; integrated circuit manufacture; integrated circuit modelling; software packages; DFM; bibliography; design alternatives; design for manufacture; integrated product development; literature survey; manufacturing capabilities; semiconductor manufacturing; software packages; software survey; Abstracts; Bibliographies; Design for manufacture; Electronics industry; Manufacturing processes; Product development; Refining; Semiconductor device manufacture; Semiconductor devices; Semiconductor materials;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher
ieee
ISSN
1083-4400
Type
jour
DOI
10.1109/3476.585146
Filename
585146
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