DocumentCode
1546322
Title
Contributions from the seventh topical meeting on electrical performance of electronic packaging
Author
Deutsch, A. ; Swaminathan, Madhavan
Author_Institution
IBM Corp.
Volume
22
Issue
3
fYear
1999
fDate
8/1/1999 12:00:00 AM
Firstpage
238
Lastpage
239
Keywords
CMOS technology; Crosstalk; Electronics packaging; Millimeter wave measurements; Millimeter wave technology; NIST; Power distribution; Power system modeling; Power system simulation; Wiring;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.1999.784470
Filename
784470
Link To Document