Title :
Contribution of resonance to ground bounce in lossy thin film planes
Author :
Pannala, Sreemala ; Bandyopadhyay, Jaya ; Swaminathan, Madhavan
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
8/1/1999 12:00:00 AM
Abstract :
This paper discusses the pulse propagation effects on lossy thin film planes. The ground bounce phenomena produced by the resonance on planes has been captured using a combination of modeling techniques and measurements. Macromodeling method has been used to explain the transient phenomena on planes by using the dominant poles and residues of the system
Keywords :
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; losses; transients; IC packaging; dominant poles; ground bounce; lossy thin film planes; macromodeling method; modeling techniques; pulse propagation effects; residues; resonance; transient phenomena; Electronics packaging; Frequency domain analysis; Impedance; Power distribution; Power system transients; Propagation losses; Resonance; Switching circuits; Time measurement; Transistors;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784472
