Title :
S-parameter based technique for simultaneous switching noise analysis in electronic packages
Author :
Jin, Zhang ; Iyer, Mahadevan K. ; Qiu, Youlin ; Ooi, Ban-Leong ; Leong, Mook-Seng
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
fDate :
8/1/1999 12:00:00 AM
Abstract :
A method based on S-parameters is developed for the analysis of simultaneous switching noise (SSN) in electronic packages. A two-port Z matrix of the package pin/trace, and the coupling between the pins/traces are modeled by analytical equations. SSN is analyzed as a function of the number of switching drivers and switching time. Frequency domain measurements are performed to demonstrate the accuracy of the model. The modeling methodology is applied to both leaded and area array packages
Keywords :
S-parameters; frequency-domain analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; plastic packaging; S-parameter based technique; area array packages; electronic packages; frequency domain measurements; leaded packages; package pin/trace; simultaneous switching noise analysis; switching drivers; switching time; two-port Z matrix; Circuit noise; Crosstalk; Electronics packaging; Frequency domain analysis; Frequency measurement; Pins; Plastic packaging; Scattering parameters; Semiconductor device modeling; Transmission line discontinuities;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784474
