Title :
Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination
Author_Institution :
Sun Microsyst. Inc., Burlington, MA, USA
fDate :
8/1/1999 12:00:00 AM
Abstract :
Power and ground planes are required to have low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances, which increase the impedance and also the radiation from the edge of the board. Resistive termination along the board edges reduces the resonance peaks. Simple and straightforward design expressions, simulated self and transfer impedances, as well as measured impedance plots are presented for power-ground planes
Keywords :
circuit noise; electric impedance; electromagnetic interference; interference suppression; printed circuit design; EMI; design; dissipative edge termination; ground plane; multilayer printed circuit board; multiple resonance; power plane; resistive termination; self-impedance; simultaneous switching noise; transfer impedance; Bandwidth; CMOS logic circuits; Computational modeling; Electromagnetic interference; Impedance measurement; Logic design; Noise reduction; Resonance; Silicon; Voltage;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.784475