Frequency-dependent crosstalk simulation for on-chip interconnections

Author

Deutsch, Alina ; Smith, Howard H. ; Surovic, Christopher W. ; Kopcsay, Gerard V. ; Webber, David A. ; Coteus, Paul W. ; Katopis, George A. ; Becker, W. Dale ; Dansky, Allan H. ; Sai-Halasz, George A. ; Restle, Phillip J.

Author_Institution

Res. Div., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

22

Issue

3

fYear

1999

fDate

8/1/1999 12:00:00 AM

Firstpage

292

Lastpage

308

Abstract

An extensive study of crosstalk simulation issues for on-chip interconnections was performed for representative six-layer Al(Cu) structures. Guidelines are given for the range of conditions when R(f)L(f)C versus RLC versus RC circuit representations are valid. Examples are also given of realistic short and long coupled-section interactions and the effect of in-plane neighboring connections is discussed. A frequency-dependent crosstalk simulation technique is shown. All simulation results are verified through measurement of a comprehensive set of experiments built with a large range of line widths and spaces on various layers with both in-plane and vertical coupling. Signal propagation and crosstalk are analyzed over the temperature range -160°C to +100°C and interconnect bandwidth limitations predictions are given

Keywords

crosstalk; integrated circuit interconnections; integrated circuit modelling; -160 to 100 C; Al-Cu; RC circuit; RLC circuit; frequency-dependent crosstalk simulation; multilayer structure; on-chip interconnection; signal propagation; Circuit simulation; Coupling circuits; Crosstalk; Extraterrestrial measurements; Frequency; Guidelines; Integrated circuit interconnections; RLC circuits; Signal analysis; Temperature distribution;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.784477

Filename

784477