DocumentCode
1546381
Title
RF/microwave characterization of multilayer ceramic-based MCM technology
Author
Sutono, Albert ; Pham, Anh-Vu H. ; Laskar, Joy ; Smith, William R.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
22
Issue
3
fYear
1999
fDate
8/1/1999 12:00:00 AM
Firstpage
326
Lastpage
331
Abstract
We present RF/microwave characterization of a 20-layer ceramic-based multichip module (MCM-C) on low temperature co-fired ceramic (LTCC). We investigated material properties and performance of embedded passives by design, fabrication and characterization of planar and multilayer integral inductors. Uniform dielectric constant, low loss property and high Q passives fabricated using this technology demonstrate the feasibility for implementing hybrid RF/microwave systems
Keywords
Q-factor; ceramic packaging; dielectric losses; inductors; multichip modules; permittivity; MCM-C technology; Q-factor; dielectric constant; embedded passive; hybrid RF-microwave packaging; loss; low temperature co-fired ceramic; multichip module; multilayer ceramic; multilayer inductor; planar inductor; Ceramics; Dielectric constant; Dielectric losses; Fabrication; Inductors; Material properties; Multichip modules; Nonhomogeneous media; Radio frequency; Temperature;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.784480
Filename
784480
Link To Document