DocumentCode
1546391
Title
Electrical characterization of integrated circuit molding compound
Author
Green, Christopher C. ; Seligman, Jeffrey M. ; Prince, John L. ; Virga, Kathleen L.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume
22
Issue
3
fYear
1999
fDate
8/1/1999 12:00:00 AM
Firstpage
337
Lastpage
342
Abstract
Broadband dielectric characterization techniques were applied to a novolac epoxy molding compound used in the integrated circuit industry. Both dielectric loss tangent and relative dielectric constant were determined over the frequency range from 100 MHz to 1.4 GHz, using two independent measurement methods. The molding compound was in “as-molded condition”, which resembles the use conditions for the material
Keywords
dielectric loss measurement; integrated circuit packaging; moulding; permittivity measurement; 100 MHz to 1.4 GHz; as-molded condition; broadband dielectric characterization techniques; dielectric loss tangent; independent measurement methods; integrated circuit molding compound; novolac epoxy molding compound; relative dielectric constant; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Fixtures; Frequency; Impedance; Reflection; Stripline; Testing;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.784482
Filename
784482
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