A 3-D stacked chip packaging solution for miniaturized massively parallel processing

Author

Lea, R. Michael ; Jalowiecki, Ian P. ; Boughton, Donald Kenneth ; Yamaguchi, James S. ; Pepe, Angel A. ; Ozguz, Volkan H. ; Carson, John C.

Author_Institution

Brunel Univ., Uxbridge, UK

Volume

22

Issue

3

fYear

1999

fDate

8/1/1999 12:00:00 AM

Firstpage

424

Lastpage

432

Abstract

The development and evaluation of a three-dimensional (3-D) interconnect and packaging technology for massively parallel processor (MPP) implementation is reported. Following reviews of specific modular massively parallel computer (MPC) accelerator and chip stacking technologies, the paper reports the progress of a collaborative research project to pioneer a novel MPP module. The design of a highly compact 3-D chip-stack, integrating five MPP chips in a single package, is described in detail. Problems encountered and their solutions are reported. Test results for prototype MPP chip-stacks provide proof-of-principle for the 3-D chip stacking approach. Allowing from 2:1 to 4:1 savings in the modular MPC implementation size, without significant increase in cost or loss of performance, the emerging MPP chip stacking technology offers a cost-effective solution for MPP miniaturization

Keywords

VLSI; associative processing; chip scale packaging; fault tolerant computing; integrated circuit interconnections; multichip modules; parallel architectures; reconfigurable architectures; 3-D interconnect; 3-D stacked chip packaging solution; MPP module; SIMD MPP; VLSI; associative string processing; cost-effective solution; defect/fault tolerance; high density interconnect; highly compact 3-D chip-stack; miniaturized massively parallel processing; modular MPC implementation size; reconfigurable data parallel computing; Application software; Application specific processors; Concurrent computing; Geophysics computing; Image storage; Military computing; Packaging; Parallel processing; Read-write memory; Stacking;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.784496

Filename

784496