Mechatronics for automotive and industrial applications

Author

Triantafyllou, Markos ; Neumann, Karl-Thomas ; Reichl, Herbert ; Ansorge, Frank ; Grosser, Volker ; Becker, Karl-Friedrich ; Schmidt, Ernst ; Maier, Reinhold

Author_Institution

Motorola TSG, Munich, Germany

Volume

22

Issue

3

fYear

1999

fDate

8/1/1999 12:00:00 AM

Firstpage

433

Lastpage

441

Abstract

Mechatronics is a multidisciplinary field, which offers low cost system solutions based on the principle of homogenizing system components and consequently to eliminate at least one material component or packaging level from the system. This leads to a decrease in the number of interconnects between the mechanical parts and the next digital bus. This system approach shows, compared to the existing solutions, a higher functionality, more intelligence, and better reliability performance. The number of interconnects necessary to link a motor, or sensor, or an actuator, to the next digital bus decreases, as the smartness of the devices increases

Keywords

automotive electronics; intelligent actuators; intelligent sensors; machine control; mechatronics; packaging; 3D packaging; AC/DC motors; H-bridge; actuators; automotive applications; concurrent engineering; control logic; data bus; device smartness; higher functionality; industrial applications; intelligent subsystem; molding on flex technology; motor control unit; reduced number of interconnects; reliability performance; sensor integration; smart ASIC; smart enhanced mechatronics; system approach; AC motors; Automotive engineering; Communication system control; Control systems; Costs; Intelligent actuators; Intelligent sensors; Mechanical sensors; Mechatronics; Packaging;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.784497

Filename

784497