Title :
Power semiconductors: Looking ahead: Consumer applications will grow for moderate-current devices while large-diameter wafers await packaging innovations
Author_Institution :
General Electric Co., Schenectady, NY, USA
Abstract :
The article underlines the role of Czochralski material in the manufacture and continues to suggest that the need for a more efficient packaging development. Comparisons are made between power transistors and thyristors together with prediction charts for power ratings and operating times. An insert is also given covering the tools and processes used in the device manufacture.
Keywords :
power transistors; thyristors; Czochralski material; device manufacture; efficient packaging; operating times; power ratings; power transistors; thyristors;
Journal_Title :
Spectrum, IEEE
DOI :
10.1109/MSPEC.1977.6501555