DocumentCode :
1547138
Title :
Power semiconductors: Looking ahead: Consumer applications will grow for moderate-current devices while large-diameter wafers await packaging innovations
Author :
Harnden, J.D.
Author_Institution :
General Electric Co., Schenectady, NY, USA
Volume :
14
Issue :
8
fYear :
1977
Firstpage :
40
Lastpage :
46
Abstract :
The article underlines the role of Czochralski material in the manufacture and continues to suggest that the need for a more efficient packaging development. Comparisons are made between power transistors and thyristors together with prediction charts for power ratings and operating times. An insert is also given covering the tools and processes used in the device manufacture.
Keywords :
power transistors; thyristors; Czochralski material; device manufacture; efficient packaging; operating times; power ratings; power transistors; thyristors;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.1977.6501555
Filename :
6501555
Link To Document :
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