DocumentCode :
1547384
Title :
Contribution of grain boundary planes to superconducting coupling in YBCO
Author :
Mironova, M. ; Stolbov, S. ; Guoping Du ; Salama, K.
Author_Institution :
Texas Center for Supercond., Houston Univ., TX, USA
Volume :
9
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
1626
Lastpage :
1629
Abstract :
High-angle grain boundaries are considered to be the main obstacle for current flow in polycrystalline bulk superconductors. In bicrystal YBCO thin films, it has been shown that the current carrying behavior of grain boundaries is strongly dependent on misorientation angles. However, grain boundaries formed by the liquid phase removal method in bulk YBCO do not show such dependence, where high-angle grain boundaries are found to be capable of carrying high currents. To understand the mechanism by which current is carried by these high-angle grain boundaries, we performed TEM studies on two high-angle boundaries whose J/sub c/ varied considerably. The misorientation characteristics and grain boundary planes for these grain boundaries were determined.
Keywords :
barium compounds; bicrystals; critical current density (superconductivity); grain boundaries; high-temperature superconductors; superconducting thin films; transmission electron microscopy; yttrium compounds; TEM; YBaCuO; bicrystal thin films; critical current density; current flow; grain boundary planes contribution; high temperature superconductors; high-angle grain boundaries; liquid phase removal method; misorientation angles; misorientation characteristics; polycrystalline bulk superconductors; superconducting coupling; transmission electron microscopy; Grain boundaries; High temperature superconductors; Optical microscopy; Superconducting films; Superconducting materials; Superconducting thin films; Superconductivity; Transistors; Transmission electron microscopy; Yttrium barium copper oxide;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.784709
Filename :
784709
Link To Document :
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