• DocumentCode
    1547722
  • Title

    Total dose effects on a fully-depleted SOI NMOSFET and its lateral parasitic transistor

  • Author

    Ferlet-Cavrois, Veronique ; Musseau, Olivier ; Leray, Jean-Luc ; Pelloie, Jean-Luc ; Raynaud, Christine

  • Author_Institution
    Centre de Bruyeres-le-Chatel, CEA, France
  • Volume
    44
  • Issue
    6
  • fYear
    1997
  • fDate
    6/1/1997 12:00:00 AM
  • Firstpage
    965
  • Lastpage
    971
  • Abstract
    The dose induced threshold voltage shift of fully-depleted NMOS transistors is strongly correlated with charge trapping in the buried oxide. Thinner buried oxides, which are less dose sensitive than thicker ones, not necessarily improve the radiation hardness of fully-depleted transistors because of the higher coupling effect. The lateral parasitic transistor is more affected by the buried oxide charge trapping than the main active transistor. The lateral and back surface conduction in the thin part of the mesa edge, increases with ionizing dose and adds to the front surface conduction. Body tie is the only lateral isolation immune to dose effects
  • Keywords
    MOS integrated circuits; MOSFET; buried layers; isolation technology; radiation effects; radiation hardening (electronics); silicon-on-insulator; NMOS transistors; Si; back surface conduction; body tie lateral isolation; buried oxide; charge trapping; coupling effect; dose induced threshold voltage shift; front surface conduction; fully-depleted SOI NMOSFET; lateral conduction; lateral parasitic transistor; mesa edge; n-channel MOSFET; radiation hardness; total dose effects; Etching; Immune system; Isolation technology; MOSFET circuits; Oxidation; Parasitic capacitance; Semiconductor films; Silicon; Substrates; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.585552
  • Filename
    585552