DocumentCode
1547722
Title
Total dose effects on a fully-depleted SOI NMOSFET and its lateral parasitic transistor
Author
Ferlet-Cavrois, Veronique ; Musseau, Olivier ; Leray, Jean-Luc ; Pelloie, Jean-Luc ; Raynaud, Christine
Author_Institution
Centre de Bruyeres-le-Chatel, CEA, France
Volume
44
Issue
6
fYear
1997
fDate
6/1/1997 12:00:00 AM
Firstpage
965
Lastpage
971
Abstract
The dose induced threshold voltage shift of fully-depleted NMOS transistors is strongly correlated with charge trapping in the buried oxide. Thinner buried oxides, which are less dose sensitive than thicker ones, not necessarily improve the radiation hardness of fully-depleted transistors because of the higher coupling effect. The lateral parasitic transistor is more affected by the buried oxide charge trapping than the main active transistor. The lateral and back surface conduction in the thin part of the mesa edge, increases with ionizing dose and adds to the front surface conduction. Body tie is the only lateral isolation immune to dose effects
Keywords
MOS integrated circuits; MOSFET; buried layers; isolation technology; radiation effects; radiation hardening (electronics); silicon-on-insulator; NMOS transistors; Si; back surface conduction; body tie lateral isolation; buried oxide; charge trapping; coupling effect; dose induced threshold voltage shift; front surface conduction; fully-depleted SOI NMOSFET; lateral conduction; lateral parasitic transistor; mesa edge; n-channel MOSFET; radiation hardness; total dose effects; Etching; Immune system; Isolation technology; MOSFET circuits; Oxidation; Parasitic capacitance; Semiconductor films; Silicon; Substrates; Threshold voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.585552
Filename
585552
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