DocumentCode
1548180
Title
Design and fabrication of compliant micromechanisms and structures with negative Poisson´s ratio
Author
Larsen, Ulrik Darling ; Signund, O. ; Bouwsta, S.
Author_Institution
Mikroelektronik Centret, Tech. Univ. Denmark, Lyngby, Denmark
Volume
6
Issue
2
fYear
1997
fDate
6/1/1997 12:00:00 AM
Firstpage
99
Lastpage
106
Abstract
This paper describes a new way to design and fabricate compliant micromechanisms and material structures with negative Poisson´s ratio (NPR). The design of compliant mechanisms and material structures is accomplished in an automated way using a numerical topology optimization method, The procedure allows the user to specify the elastic properties of materials or the mechanical advantages (MA´s) or geometrical advantages (GA´s) of compliant mechanisms and returns the optimal structures. The topologies obtained by the numerical procedure require practically no interaction by the engineer before they can be transferred to the fabrication unit. Fabrication is carried out by patterning a sputtered silicon on a plasma-enhanced chemical vapor deposition (PECVD) glass with a laser micromachining setup. Subsequently, the structures are etched into the underlying PECVD glass, and the glass is underetched, all in one two-step reactive ion etching (RIE) process. The components are tested using a probe placed on an x-y stage. This fast prototyping allows newly developed topologies to be fabricated and tested within the same day
Keywords
Poisson ratio; micromechanical devices; PECVD glass substrate; Si; compliant micromechanism; design automation; elastic properties; fabrication; fast prototyping; geometrical advantages; laser micromachining; material structure; mechanical advantages; negative Poisson ratio; numerical topology optimization; patterned sputtered silicon film; reactive ion etching; Glass; Mechanical factors; Optical device fabrication; Optimization methods; Plasma applications; Plasma chemistry; Silicon; Sputter etching; Testing; Topology;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.585787
Filename
585787
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