DocumentCode :
1548347
Title :
Novel resistive interfilamentary carbonate barriers in multifilamentary low AC loss Bi(2223)-tapes
Author :
Goldacker, W. ; Quilitz, M. ; Obst, B. ; Eckelmann, H.
Author_Institution :
Inst. fur Tech. Phys., Forschungszentrum Karlsruhe GmbH, Germany
Volume :
9
Issue :
2
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
2155
Lastpage :
2158
Abstract :
Reducing the coupling losses, one component of the AC losses in BSCCO tapes, a novel idea for a conductor geometry was developed introducing resistive layers of strontium carbonate in the matrix. Two different preparation methods were applied to introduce the layers in the interfilamentary section, a dip coating technique and a double tube method. Additionally a new ring bundle technique for multifilamentary Bi(2223)-tapes was developed based on a tape composite structure similar to a Rutherford cable with the possibility of realizing practically fully transposed filaments and with a central resistive strontium carbonate core. The achieved current densities of 10 kAcm/sup -2/ with a twist pitch of 10 mm qualifies this new conductor as a very promising alternative concept. We report on the preparation method and the superconducting properties of those tapes.
Keywords :
bismuth compounds; calcium compounds; ceramics; critical current density (superconductivity); electric field effects; high-temperature superconductors; multifilamentary superconductors; silver; strontium compounds; superconducting tapes; BiSrCaCuO-Ag; BiSrCaCuOAg-SrCO/sub 3/; Rutherford cable; dip coating technique; double tube method; multifilamentary low AC loss Bi(2223)-tapes; novel resistive interfilamentary carbonate barriers; preparation method; Bismuth compounds; Cable shielding; Conductivity; Conductors; Geometry; Strontium; Superconducting cables; Superconducting filaments and wires; Superconducting films; Superconducting materials;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.784894
Filename :
784894
Link To Document :
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