Title :
High electrical performance Ag-sheathed Bi-2223 multifilamentary tapes prepared by an optimised PIT processing route
Author :
Zeng, R. ; Yao, P. ; Zeimetz, B. ; Beales, T.P. ; Liu, H.K. ; Dou, S.X.
Author_Institution :
Inst. for Supercond. & Electron. Mater., Wollongong Univ., NSW, Australia
fDate :
6/1/1999 12:00:00 AM
Abstract :
An optimised PIT processing route is introduced and discussed, using results from experiments investigating the effect of processing on microstructure, and subsequently on J/sub c/ in PIT tapes. At 77 K and self-field, the highest J/sub c/ performance of 51000A/cm/sup 2/ has been obtained for 69-filament tapes. High critical current samples with I/sub c/=108A and J/sub c/=36000A/cm/sup 2/ have been measured at 77 K and self-field for 361-filament tapes. Our results indicated that J/sub c/ is influenced by the Pb distribution of Pb-2212, phase composition for the precursor powder, the deformation reduction rate, and the core thickness. Intermediate processing (cooling, deformation and heating) between thermal-mechanical cycles and finally cooling procedures also play an important role on Bi-2223 phase purity and achievement of such high electrical performance in the tapes.
Keywords :
bismuth compounds; calcium compounds; critical current density (superconductivity); deformation; high-temperature superconductors; multifilamentary superconductors; phase equilibrium; powder technology; silver; sintering; strontium compounds; superconducting tapes; 361-filament tapes; 69-filament tapes; 77 K; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O-Ag; Pb distribution; cooling; core thickness; critical current density; deformation reduction rate; electrical performance; microstructure; multifilamentary tapes; phase composition; phase purity; powder in tube processing; Assembly; Cooling; Critical current; Current measurement; Microstructure; Multifilamentary superconductors; Powders; Superconducting epitaxial layers; Superconducting films; Superconducting materials;
Journal_Title :
Applied Superconductivity, IEEE Transactions on