DocumentCode
1549506
Title
Full-wave analysis of conductor losses on MMIC transmission lines
Author
Heinrich, Wolfgang
Author_Institution
Inst. fuer Hochfrequenztech., Tech. Hochschule Darmstadt, West Germany
Volume
38
Issue
10
fYear
1990
fDate
10/1/1990 12:00:00 AM
Firstpage
1468
Lastpage
1472
Abstract
A mode-matching analysis of lossy planar transmission lines is presented. This method uses a modified mode-matching technique developed for travelling-wave FET analysis. The metallic layers are treated in the same way as the remaining waveguide subregions, with each of them characterized by its complex dielectric constant. This leads to a fully self-consistent description of the conductor losses. In contrast to the usual perturbation methods, it includes metallic loss by a self-consistent description without any skin-effect approximation. The analysis holds for arbitrarily high losses and also for metallization dimensions smaller than the skin depth. The approach is validated by comparison with previous experimental and theoretical work. Monolithic microwave integrated circuit (MMIC) microstrip and coplanar lines are investigated. The variation in propagation characteristics for typical metallization thickness is studied and the consequences with regard to MMIC design are discussed. For the coplanar waveguides (CPWs) significant deviations compared to the conventional assumption of lossless zero-thickness strips are found
Keywords
MMIC; losses; metallisation; strip line components; CPW; MMIC transmission lines; complex dielectric constant; conductor losses; coplanar lines; coplanar waveguides; lossy planar transmission lines; metallic layers; metallization thickness; microstrip; microwave integrated circuit; mode-matching analysis; monolithic microwave IC; propagation characteristics; Conductors; Dielectric constant; FETs; MMICs; Metallization; Perturbation methods; Planar transmission lines; Propagation losses; Transmission line theory; Transmission lines;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.58687
Filename
58687
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