Title :
Test and reliability: partners in IC manufacturing. 1
Author :
Hawkins, Charles F. ; Segura, Jaume
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Alburquerque, NM, USA
Abstract :
This article explains the major IC reliability failure mechanisms with perspectives on their severity and relation to test.
Keywords :
integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; IC manufacturing; reliability failure; test; Computer aided manufacturing; Copper; Crystallization; Electronics industry; Failure analysis; Grain boundaries; Integrated circuit testing; Lead compounds; Reliability engineering; Semiconductor device reliability;
Journal_Title :
Design & Test of Computers, IEEE
