• DocumentCode
    1549749
  • Title

    Test and reliability: partners in IC manufacturing. 1

  • Author

    Hawkins, Charles F. ; Segura, Jaume

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Alburquerque, NM, USA
  • Volume
    16
  • Issue
    3
  • fYear
    1999
  • Firstpage
    64
  • Lastpage
    71
  • Abstract
    This article explains the major IC reliability failure mechanisms with perspectives on their severity and relation to test.
  • Keywords
    integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; IC manufacturing; reliability failure; test; Computer aided manufacturing; Copper; Crystallization; Electronics industry; Failure analysis; Grain boundaries; Integrated circuit testing; Lead compounds; Reliability engineering; Semiconductor device reliability;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.785836
  • Filename
    785836
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1549749