Title :
Microgimbal torsion beam design using open, thin-walled cross sections
Author :
Muller, Lilac ; Pisano, Albert P. ; Howe, Roger T.
Author_Institution :
Berkeley Sensor & Actuator Center, California Univ., Berkeley, CA, USA
fDate :
12/1/2001 12:00:00 AM
Abstract :
A thin-film micromolding process enabled the construction of microtorsional springs with unique cross-sectional designs by combining high-aspect-ratio beams with horizontal surface features. Cross sections such as T-bars, pi sections, and channels were utilized in creating torsional springs with low torsional stiffnesses and high in- and out-of-plane bending stiffnesses. Experimental modal analysis was used to determine torsional stiffnesses as low as 0.13 μN·m/deg with T-bar springs 45 μm tall, 50 μm wide, and 100 μm long. Springs of the same outer dimensions but with solid rectangular cross sections were calculated to have torsional stiffnesses of at least two orders of magnitude greater. Several microgimbals were constructed using the thin-film micromolding process with various torsional spring designs. Modal analysis was used to experimentally determine pitch and roll natural frequencies. Torsional stiffness models for open, thin-walled sections that included warping effects were developed and used to analytically predict the torsional natural frequencies of tested spring designs to within 20%
Keywords :
bending; micromechanical devices; modal analysis; moulding; thin film devices; torsion; 100 micron; 45 micron; 50 micron; MEMS; T-bars; bending stiffnesses; channels; cross-sectional designs; fabrication technology; high-aspect-ratio beams; horizontal surface features; low torsional stiffnesses; microgimbal torsion beam design; micromachinery; microtorsional springs; modal analysis; open thin-walled sections; pi sections; pitch/roll natural frequencies; thin-film micromolding process; torsional spring designs; warping effects; Actuators; Frequency; Hard disks; Microactuators; Micromechanical devices; Modal analysis; Springs; Structural beams; Thin wall structures; Transistors;
Journal_Title :
Microelectromechanical Systems, Journal of