Title :
Modeling of interconnections and isolation within a multilayered ball grid array package
Author :
Ito, Ryosuke ; Jackson, Robert W. ; Hongsmatip, Thongchai
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
fDate :
9/1/1999 12:00:00 AM
Abstract :
A procedure is described for the electrical modeling of multilayered ball grid array (BGA) packages for use in microwave applications. The modeled package is divided into layers and a lumped-clement circuit model is developed for each layer/interconnection. A simple numerical method for computing the parasitic coupling between transitions at different locations within a layer is presented and integrated with the lumped-element model. The model is verified by comparison to measurements of a test package. This modeling procedure is useful for determining the cause of low isolation in BGA packages at microwave frequencies
Keywords :
MMIC; ball grid arrays; integrated circuit packaging; multichip modules; electrical modeling; isolation; lumped-clement circuit model; microwave applications; multilayered ball grid array package; parasitic coupling; transitions; Circuit testing; Electronics packaging; Indium tin oxide; Integrated circuit interconnections; Integrated circuit packaging; MMICs; Microwave integrated circuits; Nonhomogeneous media; Power system modeling; Radio frequency;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
