Title :
Substrate-mounted non-radiative dielectric guide for low-loss millimetre-wave integrated circuits
Author :
Tang, J. ; Deslandes, D. ; Zeng, X.-Y. ; Xu, S.-J. ; Wu, K.
Author_Institution :
Dept. de Genie Electr. et Genie Inf., Ecole Polytech. de Montreal, Que., Canada
fDate :
10/1/2001 12:00:00 AM
Abstract :
Guided-wave characteristics of a new hybrid or composite structure that consists of a nonradiative dielectric (NRD) waveguide surface mounted on the top of a relatively thin dielectric substrate are presented. This proposed structure is thus no longer a conventional NRD guide because its asymmetry may potentially generate unwanted leakage loss. Detailed numerical results show that one of the most interesting features is that it can still preserve a great deal of the desired properties of the conventional NRD guide under certain circumstances. This structure allows for a direct hybrid integration of a planar microstrip circuit with the NRD guide, thus providing an alternative design building block to a class of 3D multilayered millimetre-wave circuits. Experiments further verify the low-loss characteristics of the structure. In addition, effects of the width of ground plane are also discussed to show its low or non-radiating guided wave properties. A basic guideline in the design of a low-loss surface mounted NRD guide is provided
Keywords :
losses; microstrip circuits; millimetre wave integrated circuits; nonradiative dielectric waveguides; substrates; surface mount technology; waveguide theory; 3D multilayered millimetre-wave circuits; composite structure; dielectric substrate; ground plane width; guided-wave characteristics; hybrid integration; hybrid structure; leakage loss; low-loss MM-wave IC; low-loss characteristics; low-loss millimetre-wave integrated circuits; low-loss propagation characteristics; low-loss surface mounted NRD guide; nonradiating guided wave properties; planar microstrip circuit; substrate-mounted nonradiative dielectric guide;
Journal_Title :
Microwaves, Antennas and Propagation, IEE Proceedings
DOI :
10.1049/ip-map:20010711