• DocumentCode
    1551023
  • Title

    Rapid Thermal Treatment for Improving Thermal Processing Stability of Ar-Implanted Surface Passivated High-Resistivity Silicon

  • Author

    Liu, Chih-Yi ; Weng, Min-Hang ; Lin, Jyun-Min

  • Author_Institution
    Dept. of Electron. Eng., Nat. Kaohsiung Univ. of Appl. Sci., Kaohsiung, Taiwan
  • Volume
    21
  • Issue
    7
  • fYear
    2011
  • fDate
    7/1/2011 12:00:00 AM
  • Firstpage
    365
  • Lastpage
    367
  • Abstract
    This study improved the thermal processing stability of Si-based coplanar waveguides (CPW) through Ar ion implantation with rapid thermal annealing (RTA). Ar ion implantation damaged the surface layer of the high-resistivity silicon substrate, which decreased attenuation of the CPW line. However, the damaged layer recrystallized during a high temperature process, which caused thermal processing instability. A RTA process was performed to retard the epitaxial regrowth from the substrate, this improved thermal processing stability and decreased dc-voltage dependence of the attenuation of the CPW line. These improved properties were found to be due to the RTA process retaining more bulk traps within the damaged layer.
  • Keywords
    argon; coplanar waveguides; electrical resistivity; ion implantation; passivation; rapid thermal annealing; recrystallisation; thermal stability; Ar implanted surface passivated high resistivity silicon substrate; CPW line; DC voltage dependence; RTA process; Si based coplanar waveguide; Si:Ar; epitaxial regrowth; rapid thermal annealing; temperature process; thermal processing stability; Argon; Attenuation; Coplanar waveguides; Microwave theory and techniques; Silicon; Substrates; Thermal stability; Coplanar waveguide (CPW); microwave loss; surface passivation; thermal processing stability; thermally-induced electrical instability;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2011.2151850
  • Filename
    5871695