Plastic module of laser diode and photodiode mounted on planar lightwave circuit for access network

Author

Fukuda, Mitsuo ; Ichikawa, Fumio ; Shuto, Yoshito ; Sato, Hirotsugu ; Yamada, Yasufumi ; Kato, Kuniharu ; Tohno, Shunichi ; Toba, Hiromu ; Sugie, Toshihiko ; Yoshida, Junichi ; Suzuki, Kennichi ; Suzuki, Osamu ; Kondo, Sumio

Author_Institution

NTT Opto-Electron. Labs., Kanagawa, Japan

Volume

17

Issue

9

fYear

1999

fDate

9/1/1999 12:00:00 AM

Firstpage

1585

Lastpage

1592

Abstract

Low-cost plastic packaging of laser diodes and photodiodes mounted on planar lightwave circuit (PLC) platform are developed and its reliability is confirmed under various environmental and endurance tests. The high performance of the module is maintained under reliability tests, such as high-humidity high-temperature tests (85°C, 85%RH) and temperature cycling tests (-40°C/85°C). No laser diodes show any device characteristics change during environmental tests and their stability has very little dependence on current bias. Although the photodiodes show an increase in leakage current under high-temperature high-humidity tests and the rate of leakage current increase is proportional to the square root of bias voltage, the increase is negligible for system use. These plastic modules can be applied to actual access networks and other fiber-optic networks

Keywords

environmental testing; modules; photodiodes; plastic packaging; semiconductor device reliability; semiconductor device testing; semiconductor lasers; -40 C; 85 C; access network; endurance tests; environmental tests; fiber-optic networks; high-humidity high-temperature tests; high-temperature high-humidity tests; laser diode; low-cost plastic packaging; photodiode; planar lightwave circuit; plastic module; plastic modules; reliability test; Circuit testing; Diode lasers; Laser stability; Leakage current; Maintenance; Photodiodes; Plastic packaging; Programmable control; System testing; Temperature;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/50.788564

Filename

788564