Title :
Three-dimensional visualization of multilayered assemblies using X-ray laminography
Author :
Kalukin, Andrew R. ; Sankaran, Vijay
Author_Institution :
Center for Integrated Electron. & Electron. Manuf., Rensselaer Polytech. Inst., Troy, NY, USA
fDate :
9/1/1997 12:00:00 AM
Abstract :
The imaging technique of X-ray laminography is useful for studying defects in ball grid array, gull-wing and J-lead solder joints. In this process, X-ray images are made to depict cross-sectional planes in multilayered assemblies. It is desirable to be able to create a three-dimensional (3-D) visualization of the assembly by stacking a succession of laminographic cross sections of neighboring planes. In the past this has not been possible for highly layered assemblies because the images contain inherent blurring, which causes the signal-to noise ratio for a 3-D reconstruction to be extremely poor. This paper explains a technique for reconstructing accurate 3-D visualizations of assemblies based upon a small number of laminographic images. Experimental results are described that show that this technique is sensitive to small defects in metallic objects such as ball grid array (BGA) joints
Keywords :
X-ray imaging; image reconstruction; inspection; packaging; soldering; 3D reconstruction; 3D visualization; BGA solder joints; J-lead solder joints; X-ray images; X-ray laminography; ball grid array; cross-sectional planes; defects; gull-wing solder joints; imaging technique; metallic objects; multilayered assemblies; three-dimensional visualization; Assembly; Electronics packaging; Image reconstruction; Optical imaging; Signal to noise ratio; Soldering; Stacking; Three dimensional displays; Visualization; X-ray imaging;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on