DocumentCode :
1551243
Title :
Bountiful Baseband
Author :
Collins, L.
Volume :
6
Issue :
4
fYear :
2011
fDate :
5/1/2011 12:00:00 AM
Firstpage :
63
Lastpage :
65
Abstract :
The uptake of smartphones is driving rapid innovation in the chips that enable them. At the low end, handset makers want affordable devices for emerging markets. At the high end, demand for advanced features such as 3D HD playback is seeing chipmakers push manufacturing processes to the limit. Meanwhile, there have been key advances in the air interface and control of the modem design.
Keywords :
design engineering; innovation management; microprocessor chips; mobile computing; mobile handsets; telecommunication computing; telecommunication industry; user interfaces; 3D HD playback; advanced features; affordable devices; air interface; bountiful baseband; chipmakers; chips; emerging markets; handset makers; manufacturing processes; modern design; rapid innovation; smartphones;
fLanguage :
English
Journal_Title :
Engineering & Technology
Publisher :
iet
ISSN :
1750-9637
Type :
jour
Filename :
5871757
Link To Document :
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