DocumentCode
1551311
Title
Quasi-static analysis of coupled microstrip lines with asymmetrical finite metallization thickness
Author
Hong, Ic-Pyo ; Park, Seong-Kyoon ; Park, Han-Kyu
Author_Institution
Dept. of Radio Commun. Eng., Yonsei Univ., Seoul, South Korea
Volume
47
Issue
9
fYear
1999
fDate
9/1/1999 12:00:00 AM
Firstpage
1739
Lastpage
1742
Abstract
This paper describes the quasi-static analysis of coupled microstrip lines with asymmetrical finite metallization thickness. A generalized mode-matching method extended from the conventional mode-matching method has been used to analyze the inhomogeneous structure with arbitrary metallization thickness and is validated through comparison with those from other available results. This method cannot only provide a simple approach to the quasi-static analysis of the inhomogeneous structures with arbitrary metallization thickness, but can also be applied to analyze the effect of metal penetration depth into the substrate. The results show that the asymmetrical finite metallization thickness and metal penetration depth into the substrate can be newly added to the quasi-static design parameters of coupled microstrip lines
Keywords
MMIC; coupled transmission lines; integrated circuit metallisation; microstrip lines; mode matching; transmission line theory; arbitrary metallization thickness; asymmetrical finite metallization thickness; coupled microstrip lines; generalized mode-matching method; inhomogeneous structure; metal penetration depth; quasi-static analysis; quasi-static design parameters; substrate penetration; Coordinate measuring machines; Coupling circuits; Eigenvalues and eigenfunctions; Frequency; Metallization; Microstrip; Microwave propagation; Mode matching methods; Planar transmission lines; Radio communication;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.788617
Filename
788617
Link To Document