• DocumentCode
    1551377
  • Title

    CARAMEL: Contamination And Reliability Analysis of MicroElectromechanical Layout

  • Author

    Kolpekwar, Abhijeet ; Jiang, Tao ; Blanton, R. D Shawn

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    8
  • Issue
    3
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    309
  • Lastpage
    318
  • Abstract
    CARAMEL (Contamination And Reliability Analysis of MicroElectromechanical Layout) is a CAD tool for MEMS fault model generation. It is based on the integrated circuit contamination analysis tool CODEF and is capable of analyzing the impact of contamination particles on the behavior of microelectromechanical systems. CARAMEL´s simulation output indicates that a wide range of defective structures are possible due to the presence of particulate contaminations. Moreover, electromechanical simulations of CARAMEL´s mesh representations of defective layout has revealed that a wide variety of misbehaviors are associated with these defects. Several thousand contamination simulations were performed using CARAMEL on the surface micromachined comb-drive resonator. The results generated by CARAMEL identifies the comb drive as the most defect prone region of the microresonator and the deposition of the first structural layer as the most vulnerable processing step
  • Keywords
    CAD; micromechanical resonators; reliability theory; surface contamination; CAD tool; CARAMEL; MEMS fault model generation; comb-drive resonator; defective layout; electromechanical simulation; microelectromechanical system; microresonator; particulate contamination; reliability analysis; surface micromachining; Atmospheric modeling; Circuit analysis; Circuit faults; Circuit simulation; Design for testability; Fault diagnosis; Integrated circuit reliability; Micromechanical devices; Surface contamination; Testing;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.788635
  • Filename
    788635