• DocumentCode
    1551514
  • Title

    Fabrication and Characterization of Thin-Barrier  \\hbox {Al}_{0.5}\\hbox {Ga}_{0.5}\\hbox {N/AlN/GaN} HEMTs

  • Author

    Felbinger, Jonathan G. ; Fagerlind, Martin ; Axelsson, Olle ; Rorsman, Niklas ; Gao, Xiang ; Guo, Shiping ; Schaff, William J. ; Eastman, Lester F.

  • Author_Institution
    Dept. of Microtechnol. & Nanosci. (MC2), Chalmers Univ. of Technol., Goteborg, Sweden
  • Volume
    32
  • Issue
    7
  • fYear
    2011
  • fDate
    7/1/2011 12:00:00 AM
  • Firstpage
    889
  • Lastpage
    891
  • Abstract
    The growth, fabrication, and performance of Al0.5Ga0.5 N/AlN/GaN high-electron-mobility transistors (HEMTs) with a total barrier thickness of 7 nm are reported. An optimized surface passivation and an ohmic recess etch yield HEMTs exhibiting 0.72 S/mm peak extrinsic dc transconductance at a current density of 0.47 A/mm. Devices with a gate length of 90 nm achieve 78 GHz unity-current-gain frequency and up to 166 GHz maximum frequency of oscillation. The minimum noise figure at 10 GHz is 0.52 dB with an associated gain of 9.5 dB.
  • Keywords
    III-V semiconductors; aluminium compounds; current density; etching; gallium compounds; high electron mobility transistors; passivation; semiconductor device noise; wide band gap semiconductors; Al0.5Ga0.5N-AlN-GaN; current density; high electron mobility transistor; ohmic recess etch yield; optimized surface passivation; peak extrinsic dc transconductance; semiconductor device noise; thin-barrier HEMT fabrication; unity current gain frequency; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Noise; Aluminum gallium nitride; high-electron-mobility transistors (HEMTs); microwave noise; recessed ohmic contacts; surface passivation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2143384
  • Filename
    5872002